25LC256TISN

Manufacturer: Microchip Technology Inc

Product Category: Memory

Description:

Product Technical Specifications

Source Content uid:

25LC256T-I/SNG

Manufacturer Part Number:

25LC256T-I/SNG

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Active

Part Package Code:

SOIC

Package Description:

0.150 INCH, PLASTIC, MS-012, SOIC-8

Pin Count:

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.32.00.51

Manufacturer:

Microchip Technology Inc

Risk Rank:

6.97

Clock Frequency-Max (fCLK):

10 MHz

Data Retention Time-Min:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

EEPROM

Memory Width:

Moisture Sensitivity Level:

Number of Functions:

Number of Terminals:

Number of Words:

32768 words

Number of Words Code:

32000

Operating Mode:

SYNCHRONOUS

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE

Parallel/Serial:

SERIAL

Peak Reflow Temperature (Cel):

260

Power Supplies:

3/5 V

Qualification Status:

Not Qualified

Seated Height-Max:

1.75 mm

Serial Bus Type:

SPI

Standby Current-Max:

0.000001 A

Subcategory:

EEPROMs

Supply Current-Max:

0.005 mA

Supply Voltage-Max (Vsup):

5.5 V

Supply Voltage-Min (Vsup):

2.5 V

Supply Voltage-Nom (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

Width:

3.91 mm

Write Cycle Time-Max (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

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