74LVC1G07GW125 NXP Semiconductors | Chip 1 Exchange

74LVC1G07GW125

Manufacturer: NXP Semiconductors

Product Category: Logic

Description:

Product Technical Specifications

Source Content uid:

74LVC1G07GW,125

Manufacturer Part Number:

74LVC1G07GW,125

Brand Name:

NXP Semiconductor

Rohs Code:

Yes

Part Life Cycle Code:

Transferred

Part Package Code:

TSSOP

Package Description:

1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5

Pin Count:

5

Manufacturer Package Code:

SOT353-1

Reach Compliance Code:

compliant

HTS Code:

8542.39.00.01

Manufacturer:

NXP Semiconductors

Risk Rank:

7.63

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Logic IC Type:

BUFFER

Max I(ol):

0.024 A

Moisture Sensitivity Level:

1

Number of Functions:

1

Number of Inputs:

1

Number of Terminals:

5

Operating Temperature-Max:

125 °C

Operating Temperature-Min:

-40 °C

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

TSSOP

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TAPE AND REEL

Peak Reflow Temperature (Cel):

260

Power Supplies:

3.3 V

Propagation Delay (tpd):

8.4 ns

Qualification Status:

Not Qualified

Schmitt Trigger:

NO

Seated Height-Max:

1.1 mm

Subcategory:

Gates

Supply Voltage-Max (Vsup):

5.5 V

Supply Voltage-Min (Vsup):

1.65 V

Supply Voltage-Nom (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

AUTOMOTIVE

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

0.65 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

30

Width:

1.25 mm

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