74LVC1G17GW125

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Product Technical Specifications

Source Content uid

74LVC1G17GW,125

Part Life Cycle Code

Active

Part Package Code

TSSOP

Package Description

TSSOP,

Pin Count

5

Manufacturer Package Code

SOT353-1

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.39.00.01

Family

LVC/LCX/Z

JESD-30 Code

R-PDSO-G5

JESD-609 Code

e3

Length

2.05 mm

Logic IC Type

BUFFER

Moisture Sensitivity Level

1

Number of Functions

1

Number of Inputs

1

Number of Terminals

5

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method

TR, 7 INCH

Peak Reflow Temperature (Cel)

260

Propagation Delay (tpd)

14 ns

Seated Height-Max

1.1 mm

Supply Voltage-Max (Vsup)

5.5 V

Supply Voltage-Min (Vsup)

1.65 V

Supply Voltage-Nom (Vsup)

3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

AUTOMOTIVE

Terminal Finish

TIN

Terminal Form

GULL WING

Terminal Pitch

0.65 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

30

Width

1.25 mm

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