A3P250L-FGG144I Microsemi Corporation | Chip 1 Exchange

A3P250L-FGG144I

Manufacturer: Microsemi Corporation

Product Category: Programmable Logic

Description:

Product Technical Specifications

Manufacturer Part Number:

A3P250L-FGG144I

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

MICROSEMI CORP

Package Description:

LBGA, BGA144,12X12,40

Reach Compliance Code:

compliant

HTS Code:

8542.39.00.01

Manufacturer:

Microsemi Corporation

Risk Rank:

7.66

Clock Frequency-Max:

350 MHz

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level:

3

Number of CLBs:

6144

Number of Equivalent Gates:

250000

Number of Inputs:

97

Number of Logic Cells:

6144

Number of Outputs:

97

Number of Terminals:

144

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

6144 CLBS, 250000 GATES

Package Body Material:

PLASTIC/EPOXY

Package Code:

LBGA

Package Equivalence Code:

BGA144,12X12,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (Cel):

260

Power Supplies:

1.5/3.3 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

1.55 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.575 V

Supply Voltage-Min:

1.14 V

Supply Voltage-Nom:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

40

Width:

13 mm

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