AF82801IBM Intel Corporation | Chip 1 Exchange

AF82801IBM

Manufacturer: Intel Corporation

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Manufacturer Part Number:

AF82801IBM

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Part Package Code:

BGA

Package Description:

BGA,

Pin Count:

676

Reach Compliance Code:

unknown

HTS Code:

8542.39.00.01

Manufacturer:

Intel Corporation

Risk Rank:

5.81

Boundary Scan:

NO

Bus Compatibility:

PCI; USB; LPC

JESD-30 Code:

S-PBGA-B676

Number of Terminals:

676

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

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