BH616UV1611AIP55

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Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

BRILLIANCE SEMICONDUCTOR INC

Part Package Code

BGA

Package Description

LFBGA,

Pin Count

48

Reach Compliance Code

unknown

ECCN Code

3A991.B.2.A

HTS Code

8542.32.00.41

Access Time-Max

55 ns

JESD-30 Code

R-PBGA-B48

Length

8 mm

Memory Density

16777216 bit

Memory IC Type

STANDARD SRAM

Memory Width

16

Number of Functions

1

Number of Terminals

48

Number of Words

1048576 words

Number of Words Code

1000000

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

1MX16

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Parallel/Serial

PARALLEL

Seated Height-Max

1.4 mm

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

1.65 V

Supply Voltage-Nom (Vsup)

3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Form

BALL

Terminal Pitch

0.75 mm

Terminal Position

BOTTOM

Width

6 mm