BS62LV1027STC70

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Product Technical Specifications

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

BRILLIANCE SEMICONDUCTOR INC

Package Description

TSSOP, TSSOP32,.56,20

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.41

Access Time-Max

70 ns

I/O Type

COMMON

JESD-30 Code

R-PDSO-G32

JESD-609 Code

e0

Memory Density

1048576 bit

Memory IC Type

STANDARD SRAM

Memory Width

8

Moisture Sensitivity Level

3

Number of Terminals

32

Number of Words

131072 words

Number of Words Code

128000

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

70 °C

Operating Temperature-Min

Organization

128KX8

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP32,.56,20

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel/Serial

PARALLEL

Peak Reflow Temperature (Cel)

240

Power Supplies

3/5 V

Qualification Status

Not Qualified

Standby Current-Max

2e-7 A

Standby Voltage-Min

1.5 V

Supply Current-Max

0.038 mA

Surface Mount

YES

Technology

CMOS

Temperature Grade

COMMERCIAL

Terminal Finish

TIN LEAD

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

DUAL

Alternate Parts

BS62LV1027STC55