BSP762TXUMA1

Manufacturer: Infineon Technologies AG

Product Category: Drivers And Interfaces

Description:

Product Technical Specifications

Source Content uid:

BSP762TXUMA1

Manufacturer Part Number:

BSP762TXUMA1

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Active

Part Package Code:

SOIC

Package Description:

SOP,

Pin Count:

8

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.39.00.01

Manufacturer:

Infineon Technologies AG

Risk Rank:

1.77

Additional Feature:

ESD Value for IN pin is 1C

Adjustable Threshold:

NO

Analog IC - Other Type:

POWER SUPPLY SUPPORT CIRCUIT

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level:

3

Number of Channels:

1

Number of Functions:

1

Number of Terminals:

8

Operating Temperature-Max:

150 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE

Peak Reflow Temperature (Cel):

260

Screening Level:

AEC-Q100

Seated Height-Max:

1.75 mm

Supply Current-Max (Isup):

1.3 mA

Supply Voltage-Max (Vsup):

34 V

Supply Voltage-Min (Vsup):

5 V

Supply Voltage-Nom (Vsup):

13.5 V

Surface Mount:

YES

Technology:

SIPMOS

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

40

Width:

4 mm

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Alternate Parts

BSP762T