BUK555100A

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Product Technical Specifications

Source Content uid

BUK555-100A127

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

FLANGE MOUNT, R-PSFM-T3

Reach Compliance Code

unknown

ECCN Code

EAR99

Additional Feature

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (Eas)

140 mJ

Case Connection

DRAIN

Configuration

SINGLE WITH BUILT-IN DIODE

DS Breakdown Voltage-Min

100 V

Drain Current-Max (ID)

25 A

Drain-source On Resistance-Max

0.085 Ω

FET Technology

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code

TO-220AB

JESD-30 Code

R-PSFM-T3

Number of Elements

1

Number of Terminals

3

Operating Mode

ENHANCEMENT MODE

Operating Temperature-Max

175 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Polarity/Channel Type

N-CHANNEL

Pulsed Drain Current-Max (IDM)

100 A

Qualification Status

Not Qualified

Surface Mount

NO

Terminal Form

THROUGH-HOLE

Terminal Position

SINGLE

Transistor Application

SWITCHING

Transistor Element Material

SILICON