BUK921255B118

Manufacturer: NXP Semiconductors

Product Category: Transistors

Description:

Product Technical Specifications

Source Content uid:

BUK9212-55B,118

Manufacturer Part Number:

BUK9212-55B,118

Brand Name:

NXP Semiconductor

Rohs Code:

Yes

Part Life Cycle Code:

Transferred

Ihs Manufacturer:

NXP SEMICONDUCTORS

Part Package Code:

DPAK

Package Description:

PLASTIC, SC-63, TO-252, D-PAK-3

Pin Count:

Manufacturer Package Code:

SOT428

Reach Compliance Code:

not_compliant

ECCN Code:

EAR99

HTS Code:

8541.29.00.75

Manufacturer:

NXP Semiconductors

Risk Rank:

7.54

Avalanche Energy Rating (Eas):

172 mJ

Case Connection:

DRAIN

Configuration:

SINGLE WITH BUILT-IN DIODE

DS Breakdown Voltage-Min:

55 V

Drain Current-Max (Abs) (ID):

75 A

Drain Current-Max (ID):

75 A

Drain-source On Resistance-Max:

0.013 Ω

FET Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

Moisture Sensitivity Level:

Number of Elements:

Number of Terminals:

Operating Mode:

ENHANCEMENT MODE

Operating Temperature-Max:

175 °C

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE

Peak Reflow Temperature (Cel):

260

Polarity/Channel Type:

N-CHANNEL

Power Dissipation-Max (Abs):

150 W

Pulsed Drain Current-Max (IDM):

316 A

Qualification Status:

Not Qualified

Subcategory:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Time@Peak Reflow Temperature-Max (s):

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

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