DSPIC33EP512MU810TIPF

No Match Found

Product Technical Specifications

Source Content uid

DSPIC33EP512MU810T-I/PF

Rohs Code

Yes

Part Life Cycle Code

Active

Part Package Code

QFP

Package Description

TQFP-100

Pin Count

100

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Address Bus Width

Bit Size

Boundary Scan

YES

Clock Frequency-Max

60 MHz

External Data Bus Width

Format

FLOATING POINT

Integrated Cache

JESD-30 Code

S-PQFP-G100

JESD-609 Code

Length

14 mm

Low Power Mode

YES

Moisture Sensitivity Level

Number of DMA Channels

Number of External Interrupts

Number of Serial I/Os

Number of Terminals

100

Number of Timers

On Chip Data RAM Width

On Chip Program ROM Width

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TFQFP

Package Equivalence Code

TQFP100,.63SQ

Package Shape

SQUARE

Package Style

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Power Supplies

3.3 V

Qualification Status

Not Qualified

RAM (words)

53248

ROM Programmability

FLASH

Seated Height-Max

1.2 mm

Supply Current-Max

320 mA

Supply Voltage-Max

3.6 V

Supply Voltage-Min

3 V

Supply Voltage-Nom