EP1C12F324C8N Intel Corporation | Chip 1 Exchange

EP1C12F324C8N

Manufacturer: Intel Corporation

Product Category: Programmable Logic

Description:

Product Technical Specifications

Manufacturer Part Number:

EP1C12F324C8N

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

INTEL CORP

Package Description:

BGA, BGA324,18X18,40

Reach Compliance Code:

compliant

HTS Code:

8542.39.00.01

Manufacturer:

Intel Corporation

Risk Rank:

7.17

Samacsys Description:

FPGA, CYCLONE

Samacsys Manufacturer:

Intel

Clock Frequency-Max:

275 MHz

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level:

3

Number of CLBs:

12060

Number of Inputs:

249

Number of Logic Cells:

12060

Number of Outputs:

249

Number of Terminals:

324

Operating Temperature-Max:

85 °C

Organization:

12060 CLBS

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA324,18X18,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

260

Power Supplies:

1.5,1.5/3.3 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

2.2 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.575 V

Supply Voltage-Min:

1.425 V

Supply Voltage-Nom:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

OTHER

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

40

Width:

19 mm

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