EP1K50FI256-2N Intel Corporation | Chip 1 Exchange

EP1K50FI256-2N

Manufacturer: Intel Corporation

Product Category: Programmable Logic

Description:

Product Technical Specifications

Manufacturer Part Number:

EP1K50FI256-2N

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

INTEL CORP

Package Description:

BGA, BGA256,16X16,40

Reach Compliance Code:

compliant

HTS Code:

8542.39.00.01

Manufacturer:

Intel Corporation

Risk Rank:

5.29

Clock Frequency-Max:

37.5 MHz

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level:

3

Number of I/O Lines:

186

Number of Inputs:

186

Number of Logic Cells:

2880

Number of Outputs:

186

Number of Terminals:

256

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

186 I/O

Output Function:

MIXED

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

260

Power Supplies:

2.5,2.5/3.3 V

Programmable Logic Type:

LOADABLE PLD

Propagation Delay:

0.4 ns

Qualification Status:

Not Qualified

Seated Height-Max:

2.1 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

2.625 V

Supply Voltage-Min:

2.375 V

Supply Voltage-Nom:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

40

Width:

17 mm

Fast Shipping