EP2S180F1508C3N Intel Corporation | Chip 1 Exchange

EP2S180F1508C3N

Manufacturer: Intel Corporation

Product Category: Programmable Logic

Description:

Product Technical Specifications

Manufacturer Part Number:

EP2S180F1508C3N

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

INTEL CORP

Package Description:

40 X 40 MM, 1 MM PITCH, LEAD FREE, FBGA-1508

Reach Compliance Code:

compliant

HTS Code:

8542.39.00.01

Manufacturer:

Intel Corporation

Risk Rank:

5.29

Clock Frequency-Max:

717 MHz

Combinatorial Delay of a CLB-Max:

4.672 ns

JESD-30 Code:

S-PBGA-B1508

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level:

4

Number of CLBs:

8970

Number of Inputs:

1170

Number of Logic Cells:

179400

Number of Outputs:

1162

Number of Terminals:

1508

Operating Temperature-Max:

85 °C

Organization:

8970 CLBS

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1508,39X39,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

245

Power Supplies:

1.2,1.5/3.3,3.3 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

3.5 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.25 V

Supply Voltage-Min:

1.15 V

Supply Voltage-Nom:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

OTHER

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

30

Width:

40 mm

Fast Shipping