EP3C25F256A7N

No Match Found

Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

INTEL CORP

Package Description

LEAD FREE, MS-034, FBGA-256

Reach Compliance Code

compliant

HTS Code

8542.39.00.01

JESD-30 Code

S-PBGA-B256

Length

17 mm

Number of CLBs

24624

Number of Inputs

156

Number of Logic Cells

24624

Number of Outputs

156

Number of Terminals

256

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Organization

24624 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA256,16X16,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

1.2/3.3 V

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status

Not Qualified

Seated Height-Max

3.5 mm

Supply Voltage-Max

2.625 V

Supply Voltage-Min

2.375 V

Supply Voltage-Nom

2.5 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

AUTOMOTIVE

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Width

17 mm