EP3C25F256C8N Intel Corporation | Chip 1 Exchange

EP3C25F256C8N

Manufacturer: Intel Corporation

Product Category: Programmable Logic

Description:

Product Technical Specifications

Manufacturer Part Number:

EP3C25F256C8N

Rohs Code:

Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

INTEL CORP

Package Description:

17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256

Reach Compliance Code:

compliant

HTS Code:

8542.39.00.01

Manufacturer:

Intel Corporation

Risk Rank:

1.54

Samacsys Description:

Altera FPGA EP3C25F256C8N, Cyclone III 24624 Cells, 24624 Blocks, 256-Pin FBGA

Samacsys Manufacturer:

Intel

Clock Frequency-Max:

472.5 MHz

JESD-30 Code:

R-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level:

3

Number of CLBs:

24624

Number of Inputs:

156

Number of Logic Cells:

24624

Number of Outputs:

156

Number of Terminals:

256

Operating Temperature-Max:

85 °C

Organization:

24624 CLBS

Package Body Material:

PLASTIC/EPOXY

Package Code:

LBGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

RECTANGULAR

Package Style:

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (Cel):

260

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

1.55 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.25 V

Supply Voltage-Min:

1.15 V

Supply Voltage-Nom:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

OTHER

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

40

Width:

17 mm

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