EP3C25F256C8N

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Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Active

Package Description

17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.39.00.01

Clock Frequency-Max

472.5 MHz

JESD-30 Code

R-PBGA-B256

JESD-609 Code

e1

Length

17 mm

Moisture Sensitivity Level

3

Number of CLBs

24624

Number of Inputs

156

Number of Logic Cells

24624

Number of Outputs

156

Number of Terminals

256

Operating Temperature-Max

85 °C

Operating Temperature-Min

Organization

24624 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

LBGA

Package Equivalence Code

BGA256,16X16,40

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (Cel)

260

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status

Not Qualified

Seated Height-Max

1.55 mm

Supply Voltage-Max

1.25 V

Supply Voltage-Min

1.15 V

Supply Voltage-Nom

1.2 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Width

17 mm

Alternate Parts

EP3C25F256I7N