EP3C25F324A7N

Manufacturer: Intel Corporation

Product Category: Programmable Logic

Description:

Product Technical Specifications

Manufacturer Part Number:

EP3C25F324A7N

Rohs Code:

Yes

Part Life Cycle Code:

Active

Package Description:

LEAD FREE, FBGA-324

Reach Compliance Code:

compliant

HTS Code:

8542.39.00.01

Manufacturer:

Intel Corporation

Risk Rank:

6.82

JESD-30 Code:

S-PBGA-B324

Length:

19 mm

Number of CLBs:

24624

Number of Inputs:

215

Number of Logic Cells:

24624

Number of Outputs:

215

Number of Terminals:

324

Operating Temperature-Max:

125 °C

Operating Temperature-Min:

-40 °C

Organization:

24624 CLBS

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA324,18X18,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Power Supplies:

1.2/3.3 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

3.5 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

2.625 V

Supply Voltage-Min:

2.375 V

Supply Voltage-Nom:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

AUTOMOTIVE

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

19 mm

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Alternate Parts

EP3C25F324C7N

EP3C25F324C6N