FM25CL64B-GTR Cypress Semiconductor | Chip 1 Exchange

FM25CL64B-GTR

Manufacturer: Cypress Semiconductor

Product Category: Memory

Description:

Product Technical Specifications

Manufacturer Part Number:

FM25CL64B-GTR

Rohs Code:

Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

CYPRESS SEMICONDUCTOR CORP

Part Package Code:

SOIC

Package Description:

SOIC-8

Pin Count:

8

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.32.00.71

Manufacturer:

Cypress Semiconductor

Risk Rank:

1.01

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

65536 bit

Memory IC Type:

MEMORY CIRCUIT

Memory Width:

8

Moisture Sensitivity Level:

3

Number of Functions:

1

Number of Terminals:

8

Number of Words:

8192 words

Number of Words Code:

8000

Operating Mode:

SYNCHRONOUS

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE

Peak Reflow Temperature (Cel):

260

Power Supplies:

3.3 V

Qualification Status:

Not Qualified

Seated Height-Max:

1.75 mm

Standby Current-Max:

0.000006 A

Subcategory:

SRAMs

Supply Current-Max:

0.003 mA

Supply Voltage-Max (Vsup):

3.65 V

Supply Voltage-Min (Vsup):

2.7 V

Supply Voltage-Nom (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

30

Width:

3.9 mm

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Alternate Parts

FM25CL64BG

NA