GDPXA255A0C300

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Product Technical Specifications

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Part Package Code

BGA

Package Description

BGA, BGA256,16X16,40

Pin Count

256

Reach Compliance Code

unknown

HTS Code

8542.31.00.01

Address Bus Width

26

Bit Size

32

Boundary Scan

YES

Clock Frequency-Max

3.6864 MHz

External Data Bus Width

32

Format

FIXED POINT

Integrated Cache

YES

JESD-30 Code

S-PBGA-B256

Length

17 mm

Low Power Mode

YES

Moisture Sensitivity Level

1

Number of Terminals

256

Operating Temperature-Max

85 °C

Operating Temperature-Min

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA256,16X16,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Power Supplies

1.1,2.5/3.3,3.3 V

Qualification Status

Not Qualified

Seated Height-Max

2 mm

Speed

300 MHz

Supply Voltage-Max

1.21 V

Supply Voltage-Min

1.045 V

Supply Voltage-Nom

1.1 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Width

17 mm

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR