GDPXA255A0C400

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Product Technical Specifications

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Part Package Code

BGA

Package Description

17 X 17 MM, 1.75 MM HEIGHT, PLASTIC, BGA-256

Pin Count

256

Reach Compliance Code

unknown

HTS Code

8542.31.00.01

Address Bus Width

26

Bit Size

32

Boundary Scan

YES

Clock Frequency-Max

3.6864 MHz

External Data Bus Width

32

Format

FIXED POINT

Integrated Cache

YES

JESD-30 Code

S-PBGA-B256

Length

17 mm

Low Power Mode

YES

Number of Terminals

256

Operating Temperature-Max

85 °C

Operating Temperature-Min

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA256,16X16,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Power Supplies

1.3,2.5/3.3,3.3 V

Qualification Status

Not Qualified

Seated Height-Max

2 mm

Speed

400 MHz

Supply Voltage-Max

1.43 V

Supply Voltage-Min

1.235 V

Supply Voltage-Nom

1.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Width

17 mm

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR