H5AN8G8NCJRVKC

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Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

SK HYNIX INC

Package Description

FBGA-78

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.32.00.36

Access Mode

MULTI BANK PAGE BURST

Additional Feature

AUTO/SELF REFRESH

JESD-30 Code

R-PBGA-B78

Length

11 mm

Memory Density

8589934592 bit

Memory IC Type

DDR4 DRAM

Memory Width

8

Number of Functions

1

Number of Ports

1

Number of Terminals

78

Number of Words

1073741824 words

Number of Words Code

1000000000

Operating Mode

SYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

Organization

1GX8

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Seated Height-Max

1.2 mm

Self Refresh

YES

Supply Voltage-Max (Vsup)

1.26 V

Supply Voltage-Min (Vsup)

1.14 V

Supply Voltage-Nom (Vsup)

1.2 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Width

7.5 mm

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