HEF4023BP NXP Semiconductors | Chip 1 Exchange

HEF4023BP

Manufacturer: NXP Semiconductors

Product Category: Logic

Description:

Product Technical Specifications

Source Content uid:

HEF4023BP

Manufacturer Part Number:

HEF4023BP

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Part Package Code:

DIP

Package Description:

DIP, DIP14,.3

Pin Count:

14

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.39.00.01

Manufacturer:

NXP Semiconductors

Risk Rank:

5.27

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

NAND GATE

Max I(ol):

0.00036 A

Number of Functions:

3

Number of Inputs:

3

Number of Terminals:

14

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

RECTANGULAR

Package Style:

IN-LINE

Peak Reflow Temperature (Cel):

NOT APPLICABLE

Power Supplies:

5/15 V

Prop. Delay@Nom-Sup:

135 ns

Propagation Delay (tpd):

135 ns

Qualification Status:

Not Qualified

Schmitt Trigger:

NO

Seated Height-Max:

4.2 mm

Subcategory:

Gates

Supply Voltage-Max (Vsup):

15 V

Supply Voltage-Min (Vsup):

3 V

Supply Voltage-Nom (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

NOT APPLICABLE

Width:

7.62 mm

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