HY62WT08081EDG70C

Manufacturer: SK Hynix Inc

Product Category: Memory

Description:

Product Technical Specifications

Manufacturer Part Number:

HY62WT08081E-DG70C

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

SK HYNIX INC

Part Package Code:

SOIC

Package Description:

SOP, SOP28,.47

Pin Count:

28

Reach Compliance Code:

unknown

ECCN Code:

EAR99

HTS Code:

8542.32.00.41

Manufacturer:

SK Hynix Inc

Risk Rank:

9.43

Access Time-Max:

70 ns

Additional Feature:

IT ALSO OPERATES FROM 4.5 TO 5.5V

I/O Type:

COMMON

JESD-30 Code:

R-PDSO-G28

Length:

18.39 mm

Memory Density:

262144 bit

Memory IC Type:

SRAM STD

Memory Width:

8

Neg Supply Voltage-Nom:

-888 V

Number of Functions:

1

Number of Ports:

1, (NON-MUXED)

Number of Terminals:

28

Number of Words:

32768 words

Number of Words Code:

32000

Operating Mode:

ASYNCHRONOUS

Operating Temperature-Max:

70 °C

Organization:

32KX8

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.47

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE

Parallel/Serial:

PARALLEL

Qualification Status:

Not Qualified

Reverse Pinout:

NO

Seated Height-Max:

2.794 mm

Standby Current-Max:

0.000005 A

Standby Voltage-Min:

2 V

Supply Current-Max:

0.03 mA

Supply Voltage-Max (Vsup):

3.6 V

Supply Voltage-Min (Vsup):

2.7 V

Supply Voltage-Nom (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

COMMERCIAL

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

8.69 mm