IS21ES08G-JCLI Integrated Silicon Solution Inc | Chip 1 Exchange

IS21ES08G-JCLI

Manufacturer: Integrated Silicon Solution Inc

Product Category: Memory

Description:

Product Technical Specifications

Manufacturer Part Number:

IS21ES08G-JCLI

Rohs Code:

Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

INTEGRATED SILICON SOLUTION INC

Package Description:

VFBGA, BGA153,14X14,20

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.32.00.51

Factory Lead Time:

6 Weeks

Date Of Intro:

2016-09-13

Manufacturer:

Integrated Silicon Solution Inc

Risk Rank:

2.37

Alternate Memory Width:

1

Clock Frequency-Max (fCLK):

200 MHz

Command User Interface:

NO

Data Polling:

NO

JESD-30 Code:

R-PBGA-B153

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

68719476736 bit

Memory IC Type:

FLASH

Memory Width:

8

Moisture Sensitivity Level:

3

Number of Functions:

1

Number of Terminals:

153

Number of Words:

8589934592 words

Number of Words Code:

8000000000

Operating Mode:

SYNCHRONOUS

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

8GX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

VFBGA

Package Equivalence Code:

BGA153,14X14,20

Package Shape:

RECTANGULAR

Package Style:

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel/Serial:

PARALLEL

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Programming Voltage:

3.3 V

Seated Height-Max:

1 mm

Supply Voltage-Max (Vsup):

3.6 V

Supply Voltage-Min (Vsup):

2.7 V

Supply Voltage-Nom (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

0.5 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Toggle Bit:

NO

Type:

MLC NAND TYPE

Width:

11.5 mm

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