IS21ES08GJCLI

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Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

INTEGRATED SILICON SOLUTION INC

Package Description

VFBGA, BGA153,14X14,20

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.32.00.51

Date Of Intro

2016-09-13

Alternate Memory Width

Clock Frequency-Max (fCLK)

200 MHz

Command User Interface

Data Polling

JESD-30 Code

R-PBGA-B153

JESD-609 Code

Length

13 mm

Memory Density

68719476736 bit

Memory IC Type

FLASH

Memory Width

Moisture Sensitivity Level

Number of Functions

Number of Terminals

153

Number of Words

8589934592 words

Number of Words Code

8000000000

Operating Mode

SYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

8GX8

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Equivalence Code

BGA153,14X14,20

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel/Serial

PARALLEL

Peak Reflow Temperature (Cel)

260

Programming Voltage

3.3 V

Seated Height-Max

1 mm

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

2.7 V

Supply Voltage-Nom (Vsup)

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

0.5 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

Toggle Bit

Type

MLC NAND TYPE

Width

11.5 mm

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