K6X1008T2DGF70

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Product Technical Specifications

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Part Package Code

SOIC

Package Description

SOP, SOP32,.56

Pin Count

32

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.41

Access Time-Max

70 ns

I/O Type

COMMON

JESD-30 Code

R-PDSO-G32

JESD-609 Code

e0

Length

20.47 mm

Memory Density

1048576 bit

Memory IC Type

STANDARD SRAM

Memory Width

8

Number of Functions

1

Number of Terminals

32

Number of Words

131072 words

Number of Words Code

128000

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

128KX8

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Equivalence Code

SOP32,.56

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Parallel/Serial

PARALLEL

Power Supplies

3/3.3 V

Qualification Status

Not Qualified

Seated Height-Max

3 mm

Standby Voltage-Min

2 V

Supply Current-Max

0.02 mA

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

2.7 V

Supply Voltage-Nom (Vsup)

3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN LEAD

Terminal Form

GULL WING

Terminal Pitch

1.27 mm

Terminal Position

DUAL

Width

11.43 mm

Alternate Parts

K6X1008T2DBF70