K6X4008C1FDF70

No Match Found

Product Technical Specifications

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Part Package Code

DIP

Package Description

DIP, DIP32,.6

Pin Count

32

Reach Compliance Code

compliant

ECCN Code

3A991.B.2.A

HTS Code

8542.32.00.41

Access Time-Max

70 ns

I/O Type

COMMON

JESD-30 Code

R-PDIP-T32

Length

41.91 mm

Memory Density

4194304 bit

Memory IC Type

STANDARD SRAM

Memory Width

8

Moisture Sensitivity Level

1

Number of Functions

1

Number of Terminals

32

Number of Words

524288 words

Number of Words Code

512000

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

512KX8

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP32,.6

Package Shape

RECTANGULAR

Package Style

IN-LINE

Parallel/Serial

PARALLEL

Power Supplies

5 V

Qualification Status

Not Qualified

Seated Height-Max

5.08 mm

Standby Current-Max

0.000012 A

Standby Voltage-Min

2 V

Supply Current-Max

0.03 mA

Supply Voltage-Max (Vsup)

5.5 V

Supply Voltage-Min (Vsup)

4.5 V

Supply Voltage-Nom (Vsup)

5 V

Surface Mount

NO

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Form

THROUGH-HOLE

Terminal Pitch

2.54 mm

Terminal Position

DUAL

Width

15.24 mm