K9F1208U0BPCB0

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Product Technical Specifications

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

TSSOP, TSSOP48,.8,20

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.51

Access Time-Max

30 ns

Command User Interface

YES

Data Polling

NO

JESD-30 Code

R-PDSO-G48

JESD-609 Code

e6

Memory Density

536870912 bit

Memory IC Type

FLASH

Memory Width

8

Moisture Sensitivity Level

3

Number of Sectors/Size

4K

Number of Terminals

48

Number of Words

67108864 words

Number of Words Code

64000000

Operating Temperature-Max

70 °C

Operating Temperature-Min

Organization

64MX8

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP48,.8,20

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Page Size

512 words

Parallel/Serial

PARALLEL

Peak Reflow Temperature (Cel)

260

Power Supplies

3.3 V

Qualification Status

Not Qualified

Ready/Busy

YES

Sector Size

16K

Standby Current-Max

0.00005 A

Supply Current-Max

0.02 mA

Supply Voltage-Nom (Vsup)

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

COMMERCIAL

Terminal Finish

TIN BISMUTH

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

DUAL

Toggle Bit

NO

Fast Shipping

Alternate Parts

TC58512FT

TC58DVM92A1FT

TC58DVM92A1FT00

TC58DVM92A1FTI