K9F2G08U0B

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Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Part Package Code

TSOP1

Package Description

TSOP1,

Pin Count

48

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.51

Access Time-Max

20 ns

Additional Feature

CONTAINS ADDITIONAL 64M BIT NAND FLASH

JESD-30 Code

R-PDSO-G48

JESD-609 Code

e6

Length

18.4 mm

Memory Density

2147483648 bit

Memory IC Type

FLASH

Memory Width

8

Moisture Sensitivity Level

3

Number of Functions

1

Number of Terminals

48

Number of Words

268435456 words

Number of Words Code

256000000

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

70 °C

Operating Temperature-Min

Organization

256MX8

Package Body Material

PLASTIC/EPOXY

Package Code

TSOP1

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE

Parallel/Serial

PARALLEL

Peak Reflow Temperature (Cel)

260

Programming Voltage

3.3 V

Qualification Status

Not Qualified

Seated Height-Max

1.2 mm

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

2.7 V

Supply Voltage-Nom (Vsup)

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

COMMERCIAL

Terminal Finish

TIN BISMUTH

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

DUAL

Type

SLC NAND TYPE

Width

12 mm

Alternate Parts

K9F2G08U0BPIB

MT29F2G08ABAEAWPITETR

S34ML02G100TFI003

NAND02GW3B2CN6E

NAND02GW3B2DN6E

MT29F2G08ABAEAWPIT