K9F2G08U0BPIB0

Manufacturer: Samsung Electro-Mechanics

Product Category: Memory

Description:

Product Technical Specifications

Manufacturer Part Number:

K9F2G08U0B-PIB00

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Part Package Code:

TSOP1

Package Description:

TSOP1,

Pin Count:

48

Reach Compliance Code:

unknown

ECCN Code:

EAR99

HTS Code:

8542.32.00.51

Manufacturer:

Samsung Electro-Mechanics

Risk Rank:

9.63

Access Time-Max:

20 ns

Additional Feature:

CONTAINS ADDITIONAL 64M BIT NAND FLASH

JESD-30 Code:

R-PDSO-G48

Length:

18.4 mm

Memory Density:

2147483648 bit

Memory IC Type:

FLASH

Memory Width:

8

Number of Functions:

1

Number of Terminals:

48

Number of Words:

268435456 words

Number of Words Code:

256000000

Operating Mode:

ASYNCHRONOUS

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

256MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

TSOP1

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE, THIN PROFILE

Parallel/Serial:

PARALLEL

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Programming Voltage:

3.3 V

Qualification Status:

Not Qualified

Seated Height-Max:

1.2 mm

Supply Voltage-Max (Vsup):

3.6 V

Supply Voltage-Min (Vsup):

2.7 V

Supply Voltage-Nom (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Form:

GULL WING

Terminal Pitch:

0.5 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Type:

SLC NAND TYPE

Width:

12 mm

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