K9F5608U0D-PCB0 Samsung Semiconductor | Chip 1 Exchange

K9F5608U0D-PCB0

Manufacturer: Samsung Semiconductor

Product Category: Memory

Description:

Product Technical Specifications

Manufacturer Part Number:

K9F5608U0D-PCB0

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

SAMSUNG SEMICONDUCTOR INC

Package Description:

TSSOP, TSSOP48,.8,20

Reach Compliance Code:

unknown

ECCN Code:

EAR99

HTS Code:

8542.32.00.51

Manufacturer:

Samsung Semiconductor

Risk Rank:

8.58

Access Time-Max:

30 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e6

Memory Density:

268435456 bit

Memory IC Type:

FLASH

Memory Width:

8

Moisture Sensitivity Level:

3

Number of Sectors/Size:

2K

Number of Terminals:

48

Number of Words:

33554432 words

Number of Words Code:

32000000

Operating Temperature-Max:

70 °C

Organization:

32MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

TSSOP

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Page Size:

512 words

Parallel/Serial:

PARALLEL

Peak Reflow Temperature (Cel):

260

Power Supplies:

3/3.3 V

Qualification Status:

Not Qualified

Ready/Busy:

YES

Sector Size:

16K

Standby Current-Max:

0.00005 A

Subcategory:

Flash Memories

Supply Current-Max:

0.025 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

COMMERCIAL

Terminal Finish:

Tin/Bismuth (Sn97Bi3)

Terminal Form:

GULL WING

Terminal Pitch:

0.5 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Toggle Bit:

NO

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