K9F5608U0DJIB000

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Product Technical Specifications

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Part Package Code

BGA

Package Description

VFBGA,

Pin Count

63

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.51

Access Time-Max

45 ns

JESD-30 Code

R-PBGA-B63

Length

11 mm

Memory Density

268435456 bit

Memory IC Type

FLASH

Memory Width

8

Number of Functions

1

Number of Terminals

63

Number of Words

33554432 words

Number of Words Code

32000000

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

32MX8

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY

Parallel/Serial

PARALLEL

Programming Voltage

3.3 V

Qualification Status

Not Qualified

Seated Height-Max

1 mm

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

2.7 V

Supply Voltage-Nom (Vsup)

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Width

9 mm