K9WAG08U1D-SIB0 Samsung Semiconductor | Chip 1 Exchange

K9WAG08U1D-SIB0

Manufacturer: Samsung Semiconductor

Product Category: Memory

Description:

Product Technical Specifications

Manufacturer Part Number:

K9WAG08U1D-SIB0T

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

SAMSUNG SEMICONDUCTOR INC

Package Description:

TSSOP, TSSOP48,.8,20

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.32.00.51

Manufacturer:

Samsung Semiconductor

Risk Rank:

5.84

Access Time-Max:

25 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G48

Memory Density:

17179869184 bit

Memory IC Type:

FLASH

Memory Width:

8

Number of Sectors/Size:

16K

Number of Terminals:

48

Number of Words:

2147483648 words

Number of Words Code:

2000000000

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

2GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

TSSOP

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Page Size:

2K words

Parallel/Serial:

PARALLEL

Power Supplies:

3/3.3 V

Qualification Status:

Not Qualified

Ready/Busy:

YES

Sector Size:

128K

Standby Current-Max:

0.00005 A

Subcategory:

Flash Memories

Supply Current-Max:

0.03 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Form:

GULL WING

Terminal Pitch:

0.5 mm

Terminal Position:

DUAL

Toggle Bit:

NO

Type:

SLC NAND TYPE

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