KLM8G1GENDB0310

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Product Technical Specifications

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

VFBGA,

Reach Compliance Code

unknown

HTS Code

8542.31.00.01

Additional Feature

ALSO REQURIED 3V SUPPLY

Data Transfer Rate-Max

50 MBps

External Data Bus Width

8

Host Data Transfer Rate-Max

400 MBps

JESD-30 Code

R-PBGA-B153

Length

13 mm

Number of Terminals

153

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Seated Height-Max

0.8 mm

Supply Voltage-Max

1.95 V

Supply Voltage-Min

1.7 V

Supply Voltage-Nom

1.8 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Form

BALL

Terminal Pitch

0.5 mm

Terminal Position

BOTTOM

Width

11.5 mm

uPs/uCs/Peripheral ICs Type

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

Fast Shipping

Alternate Parts

EMMC08GM325X01U