LM75ADP118

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Product Technical Specifications

Source Content uid

LM75ADP,118

Rohs Code

Yes

Part Life Cycle Code

Not Recommended

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

TSSOP

Package Description

TSSOP8,.19

Pin Count

8

Manufacturer Package Code

SOT505-1

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Accuracy-Max (Cel)

3 Cel

Additional Feature

THERMAL WATCHDOG

Body Breadth

3 mm

Body Height

1.1 mm

Body Length or Diameter

3 mm

Housing

PLASTIC

JESD-609 Code

e4

Mounting Feature

SURFACE MOUNT

Number of Bits

11

Number of Terminals

8

Operating Current-Max

1 mA

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Output Interface Type

2-WIRE INTERFACE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP8,.19

Package Shape/Style

SQUARE

Power Supplies

2.8/5.5 V

Sensors/Transducers Type

TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

Supply Voltage-Max

5.5 V

Supply Voltage-Min

2.8 V

Surface Mount

YES

Temperature Coefficient

NEGATIVE/POSITIVE ppm/°C

Terminal Finish

NICKEL PALLADIUM GOLD

Termination Type

SOLDER

Alternate Parts

LM75BDP118

NCT75DMR2G

STDS75DS2F