LMC555CM

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Product Technical Specifications

Source Content uid

LMC555CM

Pbfree Code

Yes

Rohs Code

No

Part Life Cycle Code

Not Recommended

Part Package Code

SOIC

Package Description

SOP, SOP8,.25

Pin Count

8

Reach Compliance Code

not_compliant

ECCN Code

EAR99

HTS Code

8542.39.00.01

Date Of Intro

1993-01-01

Analog IC - Other Type

PULSE; RECTANGULAR

JESD-30 Code

R-PDSO-G8

JESD-609 Code

e0

Length

4.9 mm

Moisture Sensitivity Level

1

Number of Functions

1

Number of Terminals

8

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Output Frequency-Max

3 MHz

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Equivalence Code

SOP8,.25

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Peak Reflow Temperature (Cel)

235

Power Supplies

5 V

Qualification Status

Not Qualified

Seated Height-Max

1.753 mm

Supply Current-Max (Isup)

0.4 mA

Supply Voltage-Max (Vsup)

15 V

Supply Voltage-Min (Vsup)

1.5 V

Supply Voltage-Nom (Vsup)

5 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN LEAD

Terminal Form

GULL WING

Terminal Pitch

1.27 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

20

Width

3.9 mm

Alternate Parts

LM555D

LMC555CMMX

LMC555CMMNOPB

TS555IPT

LMC555CMMNOPB

SA555S13

LMC555CMORLMC555CMX

LMC555CMXNOPB

LMC555CM

LMC555CMNOPB

LMC555CM

NO

LMC555CMNOPB

NA

IT32002