LMC6482IMX

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Product Technical Specifications

Source Content uid

LMC6482IMX

Pbfree Code

Yes

Rohs Code

No

Part Life Cycle Code

Not Recommended

Part Package Code

SOIC

Package Description

SOP, SOP8,.25

Pin Count

8

Reach Compliance Code

not_compliant

ECCN Code

EAR99

HTS Code

8542.33.00.01

Date Of Intro

1995-01-01

Amplifier Type

OPERATIONAL AMPLIFIER

Architecture

VOLTAGE-FEEDBACK

Average Bias Current-Max (IIB)

0.000004 µA

Bias Current-Max (IIB) @25C

0.000004 µA

Common-mode Reject Ratio-Min

70 dB

Common-mode Reject Ratio-Nom

82 dB

Frequency Compensation

YES

Input Offset Current-Max (IIO)

0.000002 µA

Input Offset Voltage-Max

750 µV

JESD-30 Code

R-PDSO-G8

JESD-609 Code

e0

Length

4.9 mm

Low-Bias

YES

Low-Offset

NO

Micropower

YES

Moisture Sensitivity Level

1

Neg Supply Voltage Limit-Max

Neg Supply Voltage-Nom (Vsup)

Number of Functions

2

Number of Terminals

8

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Equivalence Code

SOP8,.25

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Packing Method

TR

Peak Reflow Temperature (Cel)

235

Power

NO

Power Supplies

3/15 V

Programmable Power

NO

Qualification Status

Not Qualified

Seated Height-Max

1.75 mm

Slew Rate-Min

0.63 V/us

Slew Rate-Nom

1.3 V/us

Supply Current-Max

1.4 mA

Supply Voltage Limit-Max

16 V

Supply Voltage-Nom (Vsup)

5 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN LEAD

Terminal Form

GULL WING

Terminal Pitch

1.27 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

20

Unity Gain BW-Nom

1500

Voltage Gain-Min

10000

Wideband

NO

Width

3.9 mm

Fast Shipping

Alternate Parts

LMC6482IMX

TLV2372IDR

ADS7946SRTET

LMC6482IMNOPB