LMV358Q1MMXNOPB

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Product Technical Specifications

Source Content uid

LMV358Q1MMX/NOPB

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Active

Part Package Code

SOIC

Package Description

TSSOP, TSSOP8,.19

Pin Count

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.33.00.01

Amplifier Type

OPERATIONAL AMPLIFIER

Architecture

VOLTAGE-FEEDBACK

Average Bias Current-Max (IIB)

0.5 µA

Bias Current-Max (IIB) @25C

0.25 µA

Common-mode Reject Ratio-Min

50 dB

Common-mode Reject Ratio-Nom

65 dB

Frequency Compensation

YES

Input Offset Current-Max (IIO)

0.05 µA

Input Offset Voltage-Max

7000 µV

JESD-30 Code

S-PDSO-G8

JESD-609 Code

Length

3 mm

Low-Bias

Low-Offset

Micropower

YES

Moisture Sensitivity Level

Number of Functions

Number of Terminals

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP8,.19

Package Shape

SQUARE

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method

Peak Reflow Temperature (Cel)

260

Power

Power Supplies

3/5 V

Programmable Power

Qualification Status

Not Qualified

Screening Level

AEC-Q100

Seated Height-Max

1.1 mm

Slew Rate-Nom

1 V/us

Supply Current-Max

0.44 mA

Supply Voltage Limit-Max

5.5 V

Supply Voltage-Nom (Vsup)

5 V

Surface Mount

YES

Technology

BICMOS

Temperature Grade

AUTOMOTIVE

Terminal Finish

MATTE TIN

Terminal Form

GULL WING

Terminal Pitch

0.65 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

Unity Gain BW-Nom

1000

Voltage Gain-Min

10000

Wideband

Width