LPC1764FBD100K

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Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Active

Package Description

LFQFP,

Reach Compliance Code

unknown

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Has ADC

YES

Address Bus Width

Bit Size

32

CPU Family

CORTEX-M3

Clock Frequency-Max

25 MHz

DAC Channels

NO

DMA Channels

YES

External Data Bus Width

JESD-609 Code

e3

Length

14 mm

Moisture Sensitivity Level

3

Number of I/O Lines

70

Number of Terminals

100

On Chip Program ROM Width

8

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Code

LFQFP

Package Shape

SQUARE

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

RAM (bytes)

32768

ROM (words)

131072

ROM Programmability

FLASH

Speed

100 MHz

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2.4 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Terminal Finish

TIN

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

30

Width

14 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC