LPC1765FBD100551

Manufacturer: NXP Semiconductors

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Source Content uid:

LPC1765FBD100,551

Manufacturer Part Number:

LPC1765FBD100,551

Brand Name:

NXP Semiconductor

Rohs Code:

Yes

Part Life Cycle Code:

Active

Part Package Code:

QFP

Package Description:

LFQFP, QFP100,.63SQ,20

Pin Count:

100

Manufacturer Package Code:

SOT407-1

Reach Compliance Code:

compliant

ECCN Code:

3A991.A.2

HTS Code:

8542.31.00.01

Manufacturer:

NXP Semiconductors

Risk Rank:

0.98

Has ADC:

YES

Bit Size:

CPU Family:

ARM7

Clock Frequency-Max:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

Length:

14 mm

Moisture Sensitivity Level:

Number of I/O Lines:

Number of Terminals:

100

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

LFQFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

SQUARE

Package Style:

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel):

260

Power Supplies:

2.5/3.3,3/3.3 V

Qualification Status:

Not Qualified

RAM (bytes):

65536

ROM (words):

262144

ROM Programmability:

FLASH

Seated Height-Max:

1.6 mm

Speed:

100 MHz

Subcategory:

Microcontrollers

Supply Voltage-Max:

3.6 V

Supply Voltage-Min:

2.4 V

Supply Voltage-Nom:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

0.5 mm

Terminal Position:

QUAD

Time@Peak Reflow Temperature-Max (s):

Width: