LPC1768FBD100

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Product Technical Specifications

Source Content uid

LPC1768FBD100

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

QFP

Package Description

LFQFP, QFP100,.63SQ,20

Pin Count

100

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Has ADC

YES

Address Bus Width

Bit Size

32

CPU Family

ARM7

Clock Frequency-Max

25 MHz

DAC Channels

YES

DMA Channels

YES

External Data Bus Width

JESD-30 Code

S-PQFP-G100

JESD-609 Code

e3

Length

14 mm

Moisture Sensitivity Level

3

Number of I/O Lines

70

Number of Terminals

100

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

LFQFP

Package Equivalence Code

QFP100,.63SQ,20

Package Shape

SQUARE

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Power Supplies

2.5/3.3 V

Qualification Status

Not Qualified

RAM (bytes)

65536

ROM (words)

131072

ROM Programmability

FLASH

Seated Height-Max

1.6 mm

Speed

100 MHz

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2.4 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin (Sn)

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

30

Width

14 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC