LPC1768FET100 NXP Semiconductors | Chip 1 Exchange

LPC1768FET100

Manufacturer: NXP Semiconductors

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Source Content uid:

LPC1768FET100

Manufacturer Part Number:

LPC1768FET100

Rohs Code:

Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

NXP SEMICONDUCTORS

Part Package Code:

BGA

Package Description:

TFBGA,

Pin Count:

100

Manufacturer Package Code:

SOT-926-1

Reach Compliance Code:

compliant

HTS Code:

8542.31.00.01

Manufacturer:

NXP Semiconductors

Risk Rank:

5.49

Has ADC:

YES

Bit Size:

32

Clock Frequency-Max:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level:

3

Number of I/O Lines:

70

Number of Terminals:

100

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

TFBGA

Package Shape:

SQUARE

Package Style:

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel):

260

Qualification Status:

Not Qualified

ROM Programmability:

FLASH

Seated Height-Max:

1.2 mm

Speed:

100 MHz

Supply Voltage-Max:

3.6 V

Supply Voltage-Min:

2.4 V

Supply Voltage-Nom:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Form:

BALL

Terminal Pitch:

0.8 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

30

Width:

9 mm

uPs/uCs/Peripheral ICs Type:

MICROCONTROLLER, RISC

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