LPC1778FBD208551 NXP Semiconductors | Chip 1 Exchange

LPC1778FBD208551

Manufacturer: NXP Semiconductors

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Source Content uid:

LPC1778FBD208,551

Manufacturer Part Number:

LPC1778FBD208,551

Brand Name:

NXP Semiconductor

Rohs Code:

Yes

Part Life Cycle Code:

Active

Part Package Code:

QFP

Package Description:

LFQFP, QFP208,1.2SQ,20

Pin Count:

208

Manufacturer Package Code:

SOT459-1

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.31.00.01

Manufacturer:

NXP Semiconductors

Risk Rank:

1.85

Has ADC:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Clock Frequency-Max:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level:

2

Number of I/O Lines:

165

Number of Terminals:

208

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

LFQFP

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

SQUARE

Package Style:

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel):

260

Power Supplies:

3.3 V

Qualification Status:

Not Qualified

RAM (bytes):

98304

ROM (words):

524288

ROM Programmability:

FLASH

Seated Height-Max:

1.6 mm

Speed:

120 MHz

Subcategory:

Microcontrollers

Supply Voltage-Max:

3.6 V

Supply Voltage-Min:

2.4 V

Supply Voltage-Nom:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

0.5 mm

Terminal Position:

QUAD

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

28 mm

uPs/uCs/Peripheral ICs Type:

MICROCONTROLLER, RISC

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