LPC2364FBD100 NXP Semiconductors | Chip 1 Exchange

LPC2364FBD100

Manufacturer: NXP Semiconductors

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Source Content uid:

LPC2364FBD100

Manufacturer Part Number:

LPC2364FBD100

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

NXP SEMICONDUCTORS

Part Package Code:

QFP

Package Description:

14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100

Pin Count:

100

Reach Compliance Code:

compliant

HTS Code:

8542.31.00.01

Manufacturer:

NXP Semiconductors

Risk Rank:

5.33

Has ADC:

YES

Bit Size:

32

CPU Family:

ARM7

Clock Frequency-Max:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level:

3

Number of I/O Lines:

70

Number of Terminals:

100

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

LFQFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

SQUARE

Package Style:

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel):

260

Power Supplies:

3.3 V

Qualification Status:

Not Qualified

RAM (bytes):

34816

ROM (words):

131072

ROM Programmability:

FLASH

Seated Height-Max:

1.6 mm

Speed:

72 MHz

Subcategory:

Microcontrollers

Supply Current-Max:

100 mA

Supply Voltage-Max:

3.6 V

Supply Voltage-Min:

3 V

Supply Voltage-Nom:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

0.5 mm

Terminal Position:

QUAD

Time@Peak Reflow Temperature-Max (s):

30

Width:

14 mm

uPs/uCs/Peripheral ICs Type:

MICROCONTROLLER, RISC

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