LPC2366FBD100

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Product Technical Specifications

Source Content uid

LPC2366FBD100

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

QFP

Package Description

14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100

Pin Count

100

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Has ADC

YES

Address Bus Width

Bit Size

32

CPU Family

ARM7

Clock Frequency-Max

25 MHz

DAC Channels

YES

DMA Channels

YES

External Data Bus Width

16

JESD-30 Code

S-PQFP-G100

JESD-609 Code

e3

Length

14 mm

Moisture Sensitivity Level

3

Number of I/O Lines

70

Number of Terminals

100

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

LFQFP

Package Equivalence Code

QFP100,.63SQ,20

Package Shape

SQUARE

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Power Supplies

3.3 V

Qualification Status

Not Qualified

RAM (bytes)

59392

ROM (words)

262144

ROM Programmability

FLASH

Seated Height-Max

1.6 mm

Speed

72 MHz

Supply Current-Max

100 mA

Supply Voltage-Max

3.6 V

Supply Voltage-Min

3 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin (Sn)

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

30

Width

14 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Fast Shipping

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