LPC2368FBD100K

No Match Found

Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Has ADC

YES

Address Bus Width

Bit Size

Boundary Scan

YES

CPU Family

ARM7

Clock Frequency-Max

25 MHz

DAC Channels

YES

DMA Channels

YES

External Data Bus Width

Format

FIXED POINT

Integrated Cache

JESD-30 Code

S-PQFP-G100

JESD-609 Code

Length

14 mm

Low Power Mode

YES

Moisture Sensitivity Level

Number of DMA Channels

Number of External Interrupts

Number of I/O Lines

Number of Serial I/Os

Number of Terminals

100

Number of Timers

On Chip Data RAM Width

On Chip Program ROM Width

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

LFQFP

Package Equivalence Code

QFP100,.63SQ,20

Package Shape

SQUARE

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

RAM (bytes)

59392

ROM (words)

524288

ROM Programmability

FLASH

Seated Height-Max

1.6 mm

Speed

72 MHz

Supply Current-Max

100 mA

Supply Voltage-Max

3.6 V

Supply Voltage-Min

3 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

Width