LPC4357FET256551

Manufacturer: NXP Semiconductors

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Source Content uid:

LPC4357FET256,551

Manufacturer Part Number:

LPC4357FET256,551

Source Url Status Check Date:

2013-06-14 00:00:00

Brand Name:

NXP Semiconductor

Rohs Code:

Yes

Part Life Cycle Code:

Active

Part Package Code:

BGA

Package Description:

LBGA, BGA256,16X16,40

Pin Count:

256

Manufacturer Package Code:

SOT740-2

Reach Compliance Code:

compliant

ECCN Code:

3A991.A.2

HTS Code:

8542.31.00.01

Manufacturer:

NXP Semiconductors

Risk Rank:

Has ADC:

YES

Address Bus Width:

Bit Size:

CPU Family:

CORTEX-M4

Clock Frequency-Max:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

Length:

17 mm

Moisture Sensitivity Level:

Number of I/O Lines:

164

Number of Terminals:

256

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

LBGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (Cel):

260

Power Supplies:

2.5/3.3 V

Qualification Status:

Not Qualified

RAM (bytes):

139264

ROM (words):

1048576

ROM Programmability:

FLASH

Seated Height-Max:

1.55 mm

Speed:

204 MHz

Subcategory:

Microcontrollers

Supply Voltage-Max:

3.6 V

Supply Voltage-Min:

2.2 V

Supply Voltage-Nom:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

Width: