LPC55S69JBD100

Manufacturer: NXP Semiconductors

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Source Content uid:

LPC55S69JBD100

Manufacturer Part Number:

LPC55S69JBD100

Part Life Cycle Code:

Active

Ihs Manufacturer:

NXP SEMICONDUCTORS

Package Description:

HLFQFP,

Reach Compliance Code:

unknown

ECCN Code:

3A991.A.2

HTS Code:

8542.31.00.01

Date Of Intro:

2019-02-26

Manufacturer:

NXP Semiconductors

Risk Rank:

7.06

Has ADC:

YES

Bit Size:

32

Clock Frequency-Max:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Number of I/O Lines:

64

Number of Terminals:

100

On Chip Program ROM Width:

8

Operating Temperature-Max:

105 °C

Operating Temperature-Min:

-40 °C

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

HLFQFP

Package Shape:

SQUARE

Package Style:

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Seated Height-Max:

1.6 mm

Speed:

100 MHz

Supply Voltage-Max:

3.6 V

Supply Voltage-Min:

1.8 V

Supply Voltage-Nom:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Form:

GULL WING

Terminal Pitch:

0.5 mm

Terminal Position:

QUAD

Width:

14 mm

uPs/uCs/Peripheral ICs Type:

MICROCONTROLLER, RISC

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Alternate Parts

LPC55S69JBD100Y

LPC55S69JBD100K