LSM330DL

Manufacturer: STMicroelectronics

Product Category: Signal Circuits

Description:

Product Technical Specifications

Source Content uid:

LSM330DL

Manufacturer Part Number:

LSM330DL

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

STMICROELECTRONICS

Part Package Code:

LGA

Package Description:

TFLGA,

Pin Count:

28

Reach Compliance Code:

compliant

HTS Code:

8542.39.00.01

Manufacturer:

STMicroelectronics

Risk Rank:

8.26

Analog IC - Other Type:

ANALOG CIRCUIT

JESD-30 Code:

R-PBGA-B28

Length:

7.5 mm

Number of Functions:

1

Number of Terminals:

28

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

TFLGA

Package Shape:

RECTANGULAR

Package Style:

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Qualification Status:

Not Qualified

Seated Height-Max:

1.1 mm

Supply Voltage-Max (Vsup):

3.6 V

Supply Voltage-Min (Vsup):

2.4 V

Supply Voltage-Nom (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Form:

BUTT

Terminal Pitch:

0.6 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

4.4 mm

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