LUPXA255A0E300 Intel Corporation | Chip 1 Exchange

LUPXA255A0E300

Manufacturer: Intel Corporation

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Manufacturer Part Number:

LUPXA255A0E300

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

INTEL CORP

Part Package Code:

BGA

Package Description:

17 X 17 MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, BGA-256

Pin Count:

256

Reach Compliance Code:

compliant

HTS Code:

8542.31.00.01

Manufacturer:

Intel Corporation

Risk Rank:

5.82

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Clock Frequency-Max:

3.6864 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Number of Terminals:

256

Operating Temperature-Max:

100 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

250

Qualification Status:

Not Qualified

Seated Height-Max:

2 mm

Speed:

300 MHz

Supply Voltage-Max:

1.43 V

Supply Voltage-Min:

1.045 V

Supply Voltage-Nom:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

40

Width:

17 mm

uPs/uCs/Peripheral ICs Type:

MICROPROCESSOR

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