M24M01-DWMN3TPK STMicroelectronics | Chip 1 Exchange

M24M01-DWMN3TPK

Manufacturer: STMicroelectronics

Product Category: Memory

Description:

Product Technical Specifications

Source Content uid:

M24M01-DWMN3TP/K

Manufacturer Part Number:

M24M01-DWMN3TP/K

Brand Name:

STMicroelectronics

Part Life Cycle Code:

Active

Package Description:

SOP,

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.32.00.51

Factory Lead Time:

14 Weeks

Manufacturer:

STMicroelectronics

Risk Rank:

1.63

Clock Frequency-Max (fCLK):

1 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

1048576 bit

Memory IC Type:

EEPROM

Memory Width:

8

Moisture Sensitivity Level:

1

Number of Functions:

1

Number of Terminals:

8

Number of Words:

131072 words

Number of Words Code:

128000

Operating Mode:

SYNCHRONOUS

Operating Temperature-Max:

125 °C

Operating Temperature-Min:

-40 °C

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE

Parallel/Serial:

SERIAL

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Seated Height-Max:

1.75 mm

Serial Bus Type:

I2C

Supply Voltage-Max (Vsup):

5.5 V

Supply Voltage-Min (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

AUTOMOTIVE

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

3.9 mm

Write Cycle Time-Max (tWC):

4 ms

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